SHT txheej txheem ntawm nto mount technology

Ib-sided los ua ke
Incoming material inspection => Silk screen solder paste (sMD glue) => SMD => Drying (curing) => Reflow soldering => Cleaning => Inspection =>Ua hauj lwm
Muab ob npaug rau ob tog
A: Incoming material inspection => Silk screen solder paste (sMD glue) on PCB A side => SMD PCB Silk screen solder paste (sMD glue) on PCB B side => SMD => Drying => Reflow soldering (preferably only on B side => Cleaning => Inspection =>Rework) .
B: Incoming material inspection => Silk screen solder paste (sMD glue) on PCB A side => SMD => Drying (curing) => Reflow soldering on A side => Cleaning => Flip board => SMD glue on PCB B side => SMD => Curing => Wave soldering on B side => Cleaning => Inspection =>Read)
Tus txheej txheem no yog tsim nyog rau refling soldering ntawm pcb ib sab thiab yoj schering rau B Ib sab ntawm lub PCB thaum muaj tsuas yog SPDs lossis SOIC (28) PINS lossis tsawg.
Ib leeg-tog sib xyaw ua ke cov txheej txheem
Incoming material inspection => Screen printing solder paste on the A side of the PCB (applying SMD glue) => SMD => Drying (curing) => Reflow soldering => Cleaning => Plug-in => Wave soldering => Cleaning => Inspection =>Ua hauj lwm
Muab ob tog sib xyaw ua ke sib xyaw ua ke
A: Incoming material inspection => Apply SMD glue on the B side of the PCB => SMD => Curing => Flip board => Plug-in on the A side of the PCB => Wave soldering => Cleaning => Inspection =>Ua hauj lwm
Thov ua ntej thiab tom qab ntawd Ntxig, uas yog tsim nyog rau qhov teeb meem uas muaj ntau SMD Cheebtsam tsis txiav txim siab Cheebtsam .
B: Incoming material inspection => Plug-in on the A side of the PCB (pin bending) => Flip board => Apply SMD glue on the B side of the PCB => SMD => Curing => Flip board => Wave soldering => Cleaning => Inspection =>Ua hauj lwm
Ntxig ua ntej thiab tom qab ntawd thov, uas yog tsim nyog rau qhov teeb meem uas muaj ntau cov khoom sib txawv dua SMD Cheebtsam .
C: Incoming material inspection => PCB A side screen printing solder paste => SMD => Drying => Reflow soldering => Plug-in, pin bending => Flip board => PCB B side SMD glue => SMD => Curing => Flip board => Wave soldering => Cleaning => Inspection =>Rework ib sab sib xyaw ua ke, b sab smd .
D: Incoming material inspection => PCB B side SMD glue => SMD => Curing => Flip board => PCB A side screen printing solder paste => SMD => Reflow soldering => Plug-in => Wave soldering => Cleaning => Inspection => Rework A side mixed assembly, B side SMD. First paste SMD on both sides, reflow soldering, then plug-in, wave soldering E: Incoming material inspection => Silk screen solder paste (smear patch glue) on the B side of the PCB => Smear => Drying (curing) => Reflow soldering => Flip board => Silk screen solder paste on the A side of the PCB => Smear => Drying = Reflow soldering 1 (local soldering can be used) => Plug-in => Wave soldering 2 (if there are few plug-in components, manual soldering can be used) => Cleaning => Inspection =>Roons ib sab mounting, b sab tov mounting .
Muab ob npaug rau ob tog sib dhos ua ke
A: Cov Khoom Taw Qhia Cov Khoom Siv, Silk Screen Solder muab tshuaj txhuam) ntawm ib sab ntawm tus PCB, txhuam hniav (kho kom huv (tu, Flip Board; Lo lo ntxhuav Screen Solder Muab Tshuaj Txhuam (smear patch nplaum (smear cov kua nplaum (smear, refergable, nyiam dua tsuas yog rau b ib sab, ntxuav kom zoo rau b ib sab, tu, tshuaj xyuas, tshuaj xyuas, ua haujlwm)
Tus txheej txheem no yog haum rau mounting loj Smds xws li PLC ntawm ob sab ntawm PCB .
B: Cov khoom siv khoom siv tshuaj ntsuam, tshuaj ntsuam cov ntawv luam tawm cov kua nplaum ntawm ib sab ntawm ib qho ntawm ib sab Ua ntawv thov SMD cov kua nplaum ntawm ib sab B ntawm PCB, SMD, kho kom huv, tshuaj xyuas) tus txheej txheem no yog tsim nyog rau kev xav rau sab pcb .